Environmental Conditioning Mechanical Test System

ABSTRACT

Among other things, a heating jacket configured for heating a mechanical testing instrument having a probe is disclosed herein. The heating jacket includes a heating element including a jacket wall, and the jacket wall extends around a probe recess, the jacket wall is configured to receive a probe of a mechanical testing instrument within the probe recess, and the heating element is mechanically isolated from the probe with a probe gap. Additionally, a system to correct for thermomechanical drift in a mechanical testing assembly is disclosed herein. The system isolates the mechanical testing instrument from thermomechanical drift of a system frame using a determined difference between, for instance, a probe displacement and a sample displacement.

CLAIM OF PRIORITY

This patent application claims the benefit of priority of U.S.Provisional Patent Application Ser. No. 62/585,516, filed Nov. 13, 2017(Attorney Docket No. 3110.019PRV), which is hereby incorporated byreference herein in its entirety.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

This invention was made with government support under DE-SC0013218awarded by the U.S. Department of Energy. The government has certainrights in the invention.

COPYRIGHT NOTICE

A portion of the disclosure of this patent document contains materialthat is subject to copyright protection. The copyright owner has noobjection to the facsimile reproduction by anyone of the patent documentor the patent disclosure, as it appears in the Patent and TrademarkOffice patent files or records, but otherwise reserves all copyrightrights whatsoever. The following notice applies to the software and dataas described below and in the drawings that form a part of thisdocument: Copyright Bruker Nano, Inc.; Goleta, Calif. All RightsReserved.

BACKGROUND

Materials (e.g., metals, polymers, composites, or the like) include aplurality of mechanical and electromechanical properties (e.g., Young'sModulus, hardness, ductility, resistance, capacitance, or the like). Oneor more instruments are used to test the mechanical andelectromechanical properties of the materials. In some examples, themechanical and electromechanical properties of the materials in anenvironment vary with the characteristics of the environment (e.g.,temperature, humidity, or fluid composition).

SUMMARY

A mechanical testing instrument a probe having a probe tip) is includedin a mechanical testing system, and the system tests the mechanicalproperties of a material sample by, for instance indenting, pulling, orscratching the sample. In some examples, the mechanical testinginstrument is heated, for instance the mechanical instrument is heatedto substantially equal a temperature of the sample of material. Byheating the probe to a temperature equal to (e.g., includingapproaching) the temperature of the sample heat transfer between thesample and the mechanical testing instrument is minimized. Accordingly,upon engagement between the sample and the probe (e.g., by pulling,scratching, or indenting the sample of material) the precision andaccuracy of the test performed by the mechanical testing instrument areimproved.

The present inventors have recognized, among other things, that aproblem to be solved can include altering the temperature of themechanical testing instrument without affecting the mechanical orelectromechanical properties of the mechanical testing instrumentincluding the shape and size of the instrument or causing it to move(e.g., through expansion or contraction, thermomechanical drift or thelike). Additionally, the present inventors have recognized, among otherthings, that a problem to be solved can include localizing heat transferproximate to the mechanical testing instrument. Further, the presentinventors have recognized, among other things, that a problem to besolved can include reducing the stress and strain applied to a heatingelement that is utilized to alter the temperature of the mechanicaltesting instrument.

The present subject matter can help provide a solution to this problem,such as by providing a heating element that is mechanically isolatedfrom the mechanical testing instrument. For instance, and in someexamples, a portion of the heating element is in close proximity to themechanical testing instrument and surrounds the instrument to allow forheat transfer from multiple directions relative to the instrument whileat the same time enclosing the instrument and minimizing escape of thetransferred heat. Additionally, the heating element is separated fromthe mechanical testing instrument by a gap (e.g., a space, a distance, avoid, a cavity, or the like). Positioning the heating element in closeproximity to the mechanical testing instrument (e.g., the tip of theprobe positioned at a distal end of the probe) localizes heat transferto the mechanical testing instrument. Accordingly, heat transfer toother portions of mechanical testing system is minimized, and theeffects of heating the other portions of the system are thereby reduced.

In contrast to heating the mechanical testing instrument with amechanically isolated heating element, in other example a heatingelement is directly coupled to a proximal end of the mechanical testinginstrument (e.g., a base of the probe). Heat generated by the heatingelement is conducted through the mechanical testing instrument towardthe distal end of the mechanical testing instrument where the mechanicaltesting instrument engages with the sample. In some examples, becausethe heating element is directly coupled with the mechanical testinginstrument, the heating of the mechanical testing instrument affects themechanical response of the mechanical testing instrument (adds mass tothe instrument). Alternatively, or in addition, the heating affects atransducer coupled with the instrument that measures displacement (andoptionally drives) the mechanical testing instrument or a force appliedto the mechanical testing instrument. Mechanically isolating the heatingelement from the mechanical testing instrument as described hereinlocalizes the heating of the mechanical testing instrument to the probe(e.g., the component that will engage with the sample) while minimizingdistributed heating of other portions of the instrument and theassociated drawbacks. Accordingly, the precision and accuracy of thetests conducted by the mechanical testing system are enhanced.

Additionally, mechanically isolating the heating element from themechanical testing instrument reduces stress and strain applied to aheating element. For instance, in some examples the heating element isdirectly coupled to the mechanical testing instrument, and themechanical testing instrument is engaged with the sample to conduct atest of the mechanical or electromechanical properties. In one example,the mechanical testing system applies a force to the mechanical testinginstrument (e.g., to indent the sample, pull the sample, or scratch thesample). Because the heating element is coupled to the mechanicaltesting instrument, such as a movable probe, the applied force is alsoapplied to the heating element. In some examples, the application offorce to the heating element reduces the lifespan or reliability of theheating element, and increases maintenance required for the heatingelement (e.g., replacement of the heating element). In other examples,the additional mass of the heating element decreases the mechanicalperformance (movement, fidelity of signal to specified movement orforce, or the like) and sensitivity of the instrument. As describedherein, by mechanically isolating the heating element from themechanical testing instrument, the effect of the heating element mass onthe mechanical testing instrument movement and sensing are minimized.Accordingly, one or more of performance, operational lifespan orreliability of both of the heating element and the mechanical testinginstrument are enhanced.

This overview is intended to provide an overview of subject matter ofthe present patent application. It is not intended to provide anexclusive or exhaustive explanation of the invention. The detaileddescription is included to provide further information about the presentpatent application.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, like numeralsmay describe similar components in different views. Like numerals havingdifferent letter suffixes may represent different instances of similarcomponents. The drawings illustrate generally, by way of example, butnot by way of limitation, various embodiments discussed in the presentdocument.

FIG. 1 is an isometric cutaway view of one example of a multi-instrumentassembly including a multiple degree of freedom sample stage.

FIG. 2 is a perspective view of a testing assembly that includes themultiple degree of freedom sample stage shown in FIG. 1.

FIG. 3 is a detailed perspective view of the testing assembly shown inFIG. 2.

FIG. 4 is a perspective view of one example of a heating jacket.

FIG. 5 is a side view of the heating jacket of FIG. 4.

FIG. 6 is a top view of the heating jacket of FIG. 4 with a probereceived in the heating jacket of FIG. 4.

FIG. 7 is a side view of a mechanical testing instrument.

FIG. 8 is a perspective view of the mechanical testing instrument ofFIG. 8.

FIG. 9 shows one example of a method for testing the mechanicalproperties of a material.

FIG. 10 is a schematic view of a system for correcting thermomechanicaldrift in a mechanical testing assembly.

FIG. 11 is a schematic view of an interferometer system

FIG. 12 shows one example of a method for correcting thermomechanicaldrift with a mechanical testing assembly.

DETAILED DESCRIPTION

FIG. 1 shows a partial cutaway view of an example multi-instrumentassembly 100. As shown, the multi-instrument assembly 100 includes aninstrument chamber 102 surrounding a testing assembly 112 and aplurality of instruments (e.g., a microscope) including first, second,third, and fourth instruments 104, 106, 108, 110. As shown, each of thefirst through fourth instruments 104-110 is clustered around an areaadjacent to the testing assembly 112. For instance, the first throughfourth instruments 104-110 are arranged and include instrument axis andfocal points or working distances (e.g., working regions) defining orwithin a localized coincidence region near the testing assembly 112, forinstance, adjacent to a multiple degree of freedom sample stage 116. Aswill be described in further detail below, the assembly 100 includes aheater that alters the temperature of one or more components of theassembly 100. Additionally, the assembly 100 includes one or moresystems to isolate and compensate for thermomechanical drift in one ormore components of the assembly 100. For instance, the position of oneor more components of the assembly 100 may vary relative to othercomponents according to changes in temperature of the components (e.g.,small-scale movements at the micrometer or nanometer level) Further, themultiple degree of freedom sample stage 116, a component of the testingassembly 112, is configured to orient a sample (e.g., the sample 300shown in FIG. 3) on a sample stage surface (e.g., the sample stagesurface 208 shown in FIGS. 2 and 3) into a plurality of orientationsrelative to two or more of the instruments of the first through fourthinstruments 104-110.

As shown in FIG. 1, the testing assembly 112 is positioned within theinstrument chamber 102, as previously described herein. As shown, thetesting assembly 112 includes a mechanical testing instrument 114 suchas an indenter, a scratch (laterally moving) mechanical testinginstrument, tensile testing instrument or the like. The mechanicaltesting instrument 114 is configured to interact with a sample presenton a sample surface stage of a sample stage, such as a multiple degreeof freedom sample stage 116. For instance, the multiple degree offreedom sample stage 116 is configured to position a sample of amaterial for interaction with the mechanical testing instrument 114while at the same time allowing for observation and further manipulationby one or more of the first through fourth instruments, 104-110.

In the example including the multi-instrument assembly 100, the assemblyincludes one or more instruments. For example one such instrument is amicroscope instrument such as a scanning electron microscope including,for instance, a first instrument 104 such as an electron gun and asecond instrument 108 such as an electron back scatter detector. Inanother option, the multi-instrument assembly 100 includes a thirdinstrument 110 such as a secondary electron back scatter detector and afourth instrument 106 such as a focused ion beam gun. In one example,the fourth instrument 106 is a tool configured to further process thesample positioned on the sample stage surface. For instance, the fourthinstrument 106, in one example a focused ion beam gun, is configured toremove portions of the sample and expose previously unavailable portionsof the sample for further study and interaction with the mechanicaltesting instrument 114 and one or more of the first through thirdinstruments 104-108.

The assembly optionally includes an environmental chamber 118 configuredto control one or more environmental characteristics including, but notlimited to, pressure, temperature, atmospheric composition, humidity orthe like. The example sub-systems for the environmental conditioningsystem include, but are not limited to, a vacuum chamber (e.g., apressure chamber configured for one or more of negative, ambient or highpressure testing), cryogenic cooling system, humidity system,atmospheric composition and high temperature systems. In an examplesystem 100 including the environment chamber 118, the chamber isincluded as part of the instrument enclosure (e.g., the enclosure is apressure vessel), allowing pressure variations from 10-6 Torr to 1000Torr. The transducer, probe, optical imaging system, and stage(including one or more degrees of freedom) fit within the pressurevessel (the instrument enclosure).

The other various environmental subsystems that control one or moreother environmental characteristics, such as temperature and humidity,are optionally mounted to the stage (e.g., the sample stage 116) and fitwithin the pressure vessel. These systems are localized to a zoneproximate to the sample and the probe. For instance, these systems areincluded in a housing that surrounds the sample and the probe andaccordingly affect a smaller volume of space relative to the remainderof the instrument enclosure. This minimizes the energy input (e.g., forheating), approach time to reach specified environmental characteristicvalues, and system requirements, while also minimizing characteristicsthat may be adverse to measurement (such as drift) to enhance testingstability.

FIG. 2 shows one example of the testing assembly 112 previously shown inFIG. 1. As previously described, the testing assembly 112 includes atesting instrument, for instance a mechanical testing instrument 114.The testing assembly 112 includes a stage configured to support andpresent a sample for testing with the instrument 114. For instance, inthe example shown in FIG. 2, the stage includes a multiple degreefreedom sample stage 116.

The testing assembly 112 includes a testing assembly platform 200 sizedand shaped to receive and mount each of the mechanical testinginstrument 114 and the stage, in this example, the multiple degree offreedom sample stage 116. The testing assembly platform 200 furtherincludes an assembly mount 202. The assembly mount 202 in one example isconfigured for positioning with and engagement to a mounting stage 101of the multi-instrument assembly 100 (see FIG. 1). In a system includingthe instruments 104-110 the assembly mount 202 allows for the actuationof the testing assembly 112 relative to the instruments 104-110.Further, the multiple degree of freedom sample stage 116 (when included)provides additional orientation and positioning ability for a samplepositioned on the sample stage surface of the multiple degree of freedomsample stage 116.

Referring again to FIG. 2, the multiple degree of freedom sample stage116 includes, in the example shown, a linear stage assembly 204. In oneexample, the linear stage assembly includes X, Y, and Z linear stagesconfigured to position the sample stage surface 208 along one or more ofthe linear axes. Additionally, the multiple degree of freedom samplestage 116 optionally includes a rotation and tilt stage assembly 206coupled with the linear stage assembly 204. In one example, the rotationand tilt stage assembly 206 is coupled in series with the linear stageassembly 204. In another example, one or more of the rotation and tiltstages is interposed between one or more of the linear stages of thelinear stage assembly 204.

In yet another example, the mechanical testing instrument 114 is coupledwith the testing assembly platform 200 with a mechanical testinginstrument linear stage 210 (e.g., a stage configured to move theinstrument relatively along an axis, such as the X axis j interposedtherebetween. In one example, the mechanical testing instrument linearstage 210 includes one or more linear stages (one or more of X, Y or Zlinear stages) configured to move the mechanical testing instrument 114relative to the sample stage surface 208 as well as one or more of thefirst through fourth instruments 104-110.

As further shown in FIG. 2, actuation and sensing cabling 212 extends toone or more portions of the testing assembly 112, for instance to eachof the linear stages of the linear stage assembly 204 as well as each ofthe rotation and tilt stages of the rotation and tilt stage assembly206. Additionally, in another example actuation and sensing cabling 212is provided for the mechanical testing instrument 114, as well as themechanical testing instrument linear stage 210. The actuation andsensing cabling 212 facilitates the actuation of each of the one or morestages, the mechanical testing instrument or the like. In anotherexample, the actuation and sensing cabling 212 is coupled with encodersprovided with each of the stages of the linear stage assembly 204, therotation and tilt stage assembly 206, and the mechanical testinginstrument linear stage 210 to facilitate the accurate actuation andpositioning and orientation measurement of the instruments and samplestage surface 208 as described herein.

Further, the multiple degree of freedom sample stage 116 is configuredto position the sample stage surface 208 within a coincidence region ofthe instruments 110 (e.g., where the focal points of the one or moreinstruments 104-110 are aligned or coincident) without undesiredcollision with any of the instruments 104-110 and the mechanical testinginstrument 114. Optionally, the mechanical testing instrument 114 on themechanical testing instrument linear stage 210 is configured tocooperate with movement of the sample stage (e.g., the multiple degreeof freedom sample stage 116) to ensure mechanical testing interaction ispossible with the sample stage surface 208 in a variety of orientations.In some examples, the movement of the mechanical testing instrument 114and the sample stage cooperate to align the sample with one or more theinstruments 104-110. For instance, a sample is aligned with themechanical testing instrument 114 while the sample is also orientedrelative to one or more of the instruments 104-110.

FIG. 3 is a detailed perspective view of the testing assembly shown inFIG. 2. The testing assembly 112 includes the mechanical testinginstrument 114. The instrument 114 is configured to engage with and testa sample 300 coupled with the sample stage surface 208 to test one ormore mechanical or electromechanical properties of the sample 300. Insome examples, the sample 300 includes one or more of metal, alloy,polymer, ceramic, glass, composite, semiconductor, biological samples orthe like.

The mechanical testing instrument 114 includes a probe 310 having aprobe tip 320. The probe 310 selectively engages with (e.g., indents,scratches, or the like) the sample 300 to measure one or more of force,deformation (indentation depth) or the like, for instance to assess oneor more properties (e.g., hardness, Young's modulus, or the like) of thesample 300. In another example, the instrument 114 includes a clampingmember to selectively couple with the sample 300 and the instrument 114applies a tensile force to the sample 300 to test one or more properties(e.g., tensile strength, Poisson's ratio, or the like) of the sample300.

As further shown in FIG. 3, the testing assembly 112 includes a heatingjacket 330 configured to heat one or more portions of the mechanicaltesting instrument 114 In one example, the heating jacket 330 heats theprobe 310 including at least the probe tip 320. In another example, theheating jacket 330 optionally heats a clamping member e.g., one or morejaws of the clamping member) provided with the probe 310, for instanceused in tensile testing. As described in greater detail herein, theheating jacket 330 is coupled to the mechanical testing assembly 114with one or more jacket support struts 370. In the example shown in FIG.3, the heating jacket 330 includes a jacket base 340 and a supportinterface 350. The one or more jacket support struts 370 are coupledwith the fastening interface 350 and couple the heating jacket 330 withthe mechanical testing instrument 114. Additionally, the jacket supportstruts 370 optionally include one or more conductive members 375, andthe one or more conductive members are in electrical communication withthe heating jacket 330 to supply an electrical signal to the heatingjacket 330 and thereby energize the heating jacket 330 to generate heat.

Heating the one or more portions of the testing assembly 112 (e.g., theprobe tip 320) minimizes heat transfer between components of the testingassembly 112. Accordingly, the accuracy of tests performed by thetesting assembly 112 is improved. In an example, the sample 300 iscoupled with the sample stage 116 (e.g., the sample stage surface 208shown in FIG. 2). The temperature of the sample 300 is optionallyaltered, for instance with a heating coil positioned proximate thesample stage surface 208. In this example, when the sample 300 isheated, and the instrument 114 (e.g., the probe tip 320) interacts withthe sample 300, heat transfers from the sample 300 to the mechanicaltesting instrument 114. In some examples, the heat transfer between thesample 300 and the instrument 114 affects the accuracy of the testresults of the testing assembly 112. The heat transferred from thesample to the probe tip 320 (or inversely with a cooled sample) lowersthe temperature of the sample 300. In some examples, mechanical orelectromechanical properties of the sample 300 vary with the temperatureof the sample 300. Accordingly, the accuracy of the results of the testsperformed by the testing assembly 112 is affected by the heattransferred to or from (and subsequent temperature change of) the sample300. Additionally, heat transferred to or from the probe (e.g., from thesample) changes the dimensions of the probe and accordingly introducesmeasurement error in either or both of force or displacementmeasurements because of expansion or contraction based on the heattransfer.

Referring again to FIG. 3, the heating jacket 330 minimizes heattransfer from the sample 300 to the mechanical testing instrument 114.For instance, the heating jacket 330 heats the instrument 114 prior totesting (and optionally during testing) to ensure the temperature of theinstrument 114 (e.g., the probe tip 320) substantially corresponds withthe temperature of the sample 300. Accordingly, heat transfer betweenthe sample 300 and the instrument 114 is minimized, and the accuracy ofthe tests performed by the testing assembly 112 is enhanced.

As described in greater detail herein, the heating jacket 330 includes aheating element 360 and a jacket base 340. The heating element 360extends from the jacket base 340. As described further herein, theheating element 360 is configured to receive the probe 310.Additionally, the heating element 360 is mechanically isolated from theprobe 310 and the probe tip 320. For instance, the heating jacket 330 iscoupled to the mechanical testing instrument 114, and the probe 310 isseparately coupled to the mechanical testing instrument 114 withoutphysical contact or engagement to the probe 310. The heating jacket 330is configured to apply non-contact heat transfer between the jacket 330and the probe 310.

FIG. 4 is a perspective view of one example of the heating jacket 330.The heating jacket 330 includes the heating element 360. As furthershown in FIG. 4, the heating element 360 includes a jacket wall 400having interior and exterior surfaces 410, 412. The interior surface 410of the jacket wall 400 surrounds (e.g., encloses, circumscribes,partially encloses or circumscribes or the like) a probe recess 420 andreceives the probe 310 therein For example, the probe 310 is positionedin the probe recess 420 (e.g., as shown in FIG. 6). The probe recess 420optionally extends through the jacket base 340, and facilitates thereception of the probe 310 by the heating jacket 330. As describedherein, the jacket wall 400, for instance the interior surface 410,includes a jacket profile corresponding to a probe profile to facilitatea proximate but disengaged positioning of the jacket wall 400 relativeto the probe 310 to enhance heat transfer of the probe while the probe310 remains mechanically isolated.

In the example shown in FIG. 4, the jacket base 340 includes a first end430A and a second end 430B. The one or more jacket support struts 370are coupled to the first end 430A and the second end 430B and positionthe heating jacket 330 in close proximity to the probe 310 whilemaintaining mechanical isolation therebetween (e.g., with a probe gap).One or more conductive members 375 associated with the struts 370deliver power between the first and second ends 430A, 430B for operationof the heating jacket 330. For instance, the conductive members 375transmit electricity between the first and second ends 430A,B of theheating jacket 330.

The heating jacket 330 includes, but is not limited to molybdenumdisilicide, platinum alloys or the like in a solid core that areoptionally machined (e.g., by electrical discharge machining) to providestress minimizing features to the heating jacket 330. For instance, aplurality of channels 440 are optionally included in the heating jacket330 to circuitously route electricity from the first end 430A to thesecond end 430B and thereby resistively heat the heating jacket 330along the jacket wall 400. Additionally, the plurality of channels 440facilitate the tuning of the resistance and thereby heating) of theheating jacket 340 through variation of the cross-sectional area at thevarious segments 450 and corners 460 of the jacket 330. Accordingly, thechannels 440 facilitate the control of the heat generated by the heatingelement 360. Further, the cutouts 440 facilitate the expansion andcontraction of the jacket wall 400 in a lateral manner relative to theprobe recess 420 while minimizing radial expansion or contraction of thejacket wall 400 and corresponding engagement with the probe.

FIG. 5 is a side view of the heating jacket of FIG. 4, The heatingjacket 330 includes the jacket base 340 and the heating element 360. Aspreviously described, the heating element 360 (including the jacket wall400) is coupled to the jacket base 340 with a first leg 500A and asecond leg 500B. The first leg 500A is in electrical communication withthe second leg 500B through the heating element 360 including in thisexample the serpentine segments and corners of the jacket wall 400.Accordingly, an electrical signal transmitted through the first leg 500Ais transmitted through the heating element 360 to the second leg 500B toinitiate heating in the jacket wall 400.

FIG. 6 is a top view of the heating jacket of FIG. 4 with the probe 310received in the heating jacket 330. As shown, the probe 310 is receivedin the probe recess 420 of the heating jacket 330. A probe gap 600 isprovided between the probe 310 and the heating element 360 (e.g.,between the jacket wall 400 and the probe 310). The jacket wall 400,such as the interior surface 410 of the jacket wall 400, includes ajacket profile 610 corresponding to a probe profile 620 of the probe310. The corresponding profiles facilitate the reception of the probe310, mechanical isolation of the probe 310, and at the same time ensureheat generated at the jacket wall 400 is immediately delivered acrossthe intervening probe gap 600 to the probe 310. In this example, becausethe heating element 360 is mechanically isolated from the probe 310, theheating element 360 does not conduct heat to the probe 310. Instead, theheating element (e.g., the jacket wall 400) transfers heat to the probe310 through one or more non-contact modes of heating, for exampleradiative or convective modes of heat transfer as well as inductiveheating (described herein).

As described herein, the jacket wall 400 (shown in FIG. 4) includes thejacket profile 610. For instance, the jacket profile 610 issubstantially circular or cylindrical and corresponds to one or more ofthe shape, contour or size of the interior surface of the jacket wall400. Conversely, the probe 310 includes the probe profile 620. In theexample provided in FIG. 6, the probe profile 620 corresponds to thejacket profile 610. For instance, the jacket profile 610 issubstantially circular or cylindrical and includes one or more of ashape, contour or size approximating the probe profile 620. Thecorrespondence between the jacket profile 610 and the probe profile 620ensures the probe gap 600 is minimal therebetween while ensuring theprobe 310 is mechanically isolated from the jacket wall 400. In oneexample, the jacket profile 610 includes dimensions that are slightlylarger than the probe profile 620. Accordingly, the jacket 330 is sizedand shaped to receive the probe 310 in the probe recess 420 (shown inFIG. 4). Similarly, the jacket profile is optionally aligned with (e.g.,concentrically, axially, or the like) with the probe profile 620 tofacilitate the reception of the probe 310 within the probe recess 420.Accordingly, the correspondence between the jacket profile 610 and theprobe profile 620 ensures high fidelity of heat transfer (e.g., withminimal heat transfer loss) while also maintaining mechanical isolationof the jacket 330 from the probe 310.

Referring again to the example shown in FIG. 6, the heating element 360(e.g., the inner surface 410 of the jacket wall 400) is in closeproximity to the probe 310. Additionally, the heating element 360surrounds the probe 310 including one or more of a continuous enclosingof the probe 310, continuous enclosing with breaks for the channels 440,continuous enclosing with gaps between discrete portions of the jacketwall 400 (e.g., gaps between posts, elements or the like). Thepositioning of the jacket wall 400 in close proximity to the probe 310enhances heat transfer between the heating element 360 and the probe310. Additionally, surrounding the probe 310 with the heating element360 further enhances heat transfer by directing heat from multipledirections toward the probe 310 while at the same time using the heatedjacket wall 400 to minimize escape of accumulated heat in the probe 310(e.g., through gaps). For example, heat transfer is accomplished frommultiple directions relative to the probe 310 (e.g., along perimeter ofthe probe 310 from the interior surface 410, shown in FIG. 4) whileopenings in the jacket wall 400 are optionally minimized tocorrespondingly minimize the escape of heat.

FIG. 7 is a side view of another example of a mechanical testinginstrument 114. The mechanical testing instrument 114 includes the probe310 and another example of the heating jacket 330. In this example, theheating jacket 330 is coiled around the probe 310 and is mechanicallyisolated from the probe 310. For instance, the probe 310 includes theprobe profile 620, and the heating jacket 330 includes the jacketprofile 610. The jacket profile 610 corresponds with the probe profile620, and the jacket profile 610 and the probe profile 620 surround aprobe gap 600. The jacket wall 400 is positioned in close proximity tothe probe 310 and surrounds (e.g., coils around) the probe 310 to allowfor heat transfer (or inductive heating) from multiple directionsrelative to the probe 310.

Electricity is transmitted to the first leg 500A and transmitted throughthe heating jacket 330 to the second leg 500B. In this example, theheating jacket 330 inductively heats the probe 310 to alter thetemperature of the probe 310. For instance, the transmission ofelectricity through the heating jacket 330 generates a magnetic field,and the magnetic field correspondingly excites and thereby heats theprobe 310. In this example, the heating jacket 330 is mechanicallyisolated from the probe 310, and the heat transfer is a non-contact modeof heat transfer (e.g., inductive heating).

In another example, the heating jacket 330 includes a passageway, and afluid is pumped through the heating jacket 330 to heat or cool the probe310. For instance, a chilled fluid (relative to the temperature of theprobe 310) is pumped into the first leg 500A and through the heatingjacket 330. The fluid flows through the heating jacket 330 and cools theprobe 310 (e.g., through convection or thermal radiation), and the fluidexits the second leg 500B of the heating jacket 330, for instance forheating or cooling and is then recirculated through the jacket.

FIG. 8 is a perspective view of the mechanical testing instrument ofFIG. 8. In this example, a shield 800 substantially surrounds theheating jacket 330 to enhance heat transfer to the probe 310. In oneexample, the shield 800 reflects infrared energy that is otherwisedissipated by the probe 310. In another example, the shield 800 directsthe magnetic field generated by the heating jacket 330 to enhance theinductive heating of the probe 310. In yet another example, the shield800 is positioned proximate the heating jacket 330 shown in FIG. 3-6 toinsulate the probe 310 or to reflect infrared energy generated by theheating element 360 inwardly back toward the element 360 and toward theprobe 310.

FIG. 9 shows one example of a method 900 for testing the mechanicalproperties of a material, including one or more of mechanical testinginstrument 114, the probe 310, or the heating jacket 330 as describedherein. In describing the method 900, reference is made to one or morecomponents, features, functions and operations previously describedherein. Where convenient, reference is made to the components, features,operations and the like with reference numerals. The reference numeralsprovided are exemplary and are not exclusive. For instance, components,features, functions, operations and the like described in the method 900include, but are not limited to, the corresponding numbered elementsprovided herein and other corresponding elements described herein (bothnumbered and unnumbered) as well as their equivalents.

At 910, a probe 310 of a mechanical testing instrument 114 ispositioned. within a probe recess 420 of a heating jacket 330 having ajacket wall 400. The jacket wall 400 includes a jacket profile 610corresponding with a probe profile 620 of the probe 310. The jacket wall400 is proximate to the probe 310 according to the correspondence of thejacket profile 610 to the probe profile 620.

At 920, a heating element 360 of the heating jacket 330 is energized.For example, an electrical signal (e.g., current or the like) isdelivered to the heating jacket 330 to initiate one or more of resistiveheating of the element 360, induction of the element or the like.

At 930, heat from the jacket wall 400 is directed toward the probe 310and across a probe gap 600 according to the correspondence of the jacketprofile 610 to the probe profile 620 to alter the temperature of theprobe 310. In another example heating includes inductively heating theprobe 310 across the probe gap 600 with the magnetic field generatedwith the jacket 330 (as shown in FIG. 7).

At 940, the method 900 includes moving the probe 310 to perform amechanical or electromechanical test. In one example, moving the probe310 includes one or more of translation, rotation or lateral scratchingmovement within the probe recess 420, and the jacket wall 400mechanically isolates the probe 310 with each of the one or moremovements. Accordingly, the probe 310 has one or more degrees of freedomrelative to the heating jacket 330 (including, but not limited toreciprocating, rotating, or the like).

Several options for the method 900 follow. For instance, the probe 310is engaged with the sample 300. In an example, engaging the probe 310with the sample 300 includes applying a force to the probe 310 with themechanical testing instrument 114.

FIG. 10 is a schematic view of a system 1000 for correctingthermomechanical drift in a mechanical testing assembly. The system 1000includes a system frame 1010 and the mechanical testing instrument 114.In some examples, the system frame 1010 corresponds to the testingassembly platform 200 shown in FIG. 2. The system 1000 optionallyincludes an MTI (mechanical testing instrument) actuator 1020 thatallows for actuation and positioning of the mechanical testinginstrument 114 relative to the system frame 1010 (e.g., in one or moredirections, for instance up or down relative to the system frame 1010).In some examples, the MTI actuator 1020 corresponds to the mechanicaltesting instrument linear stage 210 shown in FIG. 2. The mechanicaltesting instrument 114 includes a probe 310, and the probe 310 isactuated by a probe actuator 1025 (such as a capacitive transducer) toposition the probe 310 relative to the instrument 114. In some examples,a sensor (e.g., a transducer) is included in the probe actuator todetermine, for example, a load (e.g., force) applied to the probe 310 orthe displacement of the probe 310. In another example, the probeactuator 1025 includes a transducer that applies one or more specifiedloads, displacements of the probe 310 and also measures one or moreresulting loads, displacements or the like (e.g., actual resulting loadsor displacements in contrast to the applied loads or displacements).

The system 1000 for correcting thermomechanical drift includes aninterferometer system 1030. As shown in FIG. 10, the interferometersystem 1030 is coupled with the mechanical testing instrument 114. Inthis example, the interferometer system 1030 includes a firstinterferometer 1040A and a second interferometer 1040B. The firstinterferometer 1040A is coupled between the probe 310 and a remainder ofthe mechanical testing instrument 114. The first interferometer 1040Adetermines a probe displacement ΔX_(F) of the probe 310 relative to theremainder of the mechanical testing instrument 114. The probedisplacement ΔX_(F) corresponds to the movement of the probe andaccordingly provides an accurate representative of the probe movement tomeasure actual indentation depth or other displacement based values ofthe probe relative to a sample and the remainder of the mechanicaltesting instrument.

In an example, the first interferometer 1040A splits a first coherentbeam of light into a first component beam and a second component beam.The first coherent beam of light is produced by a light source, forinstance a laser generator (e.g., the laser generator 1111 shown in FIG.11). The first coherent beam of light is transmitted through a medium,for example an optical fiber (e.g., the optical fiber 1120) including afiber end (e.g., a cleaved end 1125 of the optical fiber 1120, shown inFIG. 11). The first coherent beam of light reaches the fiber end, and issplit into the first component beam and the second component beamforming an optical cavity. In sonic examples, the first component beam(e.g., a reference beam) is reflected back from the fiber end, and thesecond component beam (e.g., an active beam) escapes the optical fiberand is transmitted toward a target (e.g., the probe 310, or for example,a back side of the probe 310 opposite the probe tip 320). The secondcomponent beam is reflected off the target and back into the opticalfiber. Optionally, the first component beam and the second componentbeam are combined (e.g., recombined) within the optical fiber, and insome examples the first component beam interferes with the secondcomponent beam into an interference signal.

An optical detector (e.g., the optical detector 1117 shown in FIG. 11)detects the interference signal. In some examples, the component beamsor the coherent beam us modulated with one or more of wavelengthmodulation, phase modulation, or cavity modulation. The detectedcomponent beams (e.g., the interference signal) are processed (e.g., bythe synchronous demodulator 1118 shown in FIG. 11) to determine thedisplacement between the target and the fiber end. In one example, thedisplacement is determined using fringe counting. Fringe countingincludes observing (e.g., with the optical detector) an interferencefringe pattern produced by the combined first component beam and thesecond component beam. In this example, because the combined firstcomponent beam and the second component beam are out of phase,interference (e.g., constructive interference or destructiveinterference) by the component beams produces a fringe pattern (e.g., agradient of light and dark banding) when observed. The distance betweenfringes of the fringe pattern is known, for example the distance betweenlight and dark bands of the fringe pattern corresponds to a wavelengthof the first coherent light beam. The system 1000 analyzes the fringepattern and accordingly determine the distance between the fiber end andthe target. For instance, the system 1000 counts changes from light todark banding to determine the change in distance of the target relativeto the fiber end. Accordingly, the first interferometer 1040A allows fora determination of the probe displacement ΔX_(F) of the probe 310relative to the remainder of the mechanical testing instrument 114.Additionally, the probe displacement corresponds in one example to anindentation depth of a tip of the probe 310 into a sample. As describedherein, the probe displacement is, in another example, used incombination with displacement of the mechanical testing instrument 114relative to the system frame 1010 to refine measurements of indentationdepth to isolate and remove thermomechanical drift.

In another example, the displacement is determined using quadraturedetection where the quadrature point is detected in the fringe pattern.For instance, the quadrature point (e.g., inflection point, or themidway point between constructive interference and destructiveinterference of the combined component beams) provides maximumsensitivity to changes in distance between the fiber end and the target.

The second interferometer 1040B is coupled between the mechanicaltesting instrument 114 and the system frame 1010. The secondinterferometer determines a sample displacement ΔXD of the sample stage(e.g., the sample stage 116 shown in FIGS. 1-3) or the sample 300relative to the mechanical testing instrument 114. For instance, thesecond interferometer 1040B splits a second coherent beam of light intoa third component beam (e.g., the reference beam) and a fourth componentbeam (e.g., the active beam). Optionally, the third component beam andthe fourth component beam are combined into an interference signal. Theinterference signal is detected and processed to determine thedisplacement between the second laser interferometer 1040B (e.g., afiber end) and the sample stage or the sample 300. This facilitatesprecise and accurate measurement of the position (and movement) of themechanical testing instrument 114 relative to the sample stage and thesystem frame 1010.

Referring again to FIG. 10, the system 1000 for correctingthermomechanical drift includes an isolation and measurement module 1050in communication with the interferometer system 1030. The module 1050optionally includes a processing unit (e.g., an ASIC, CPU, or the like)that processes data received from the interferometer system 1030. In anexample, the module 1050 determines a difference between the probedisplacement ΔX_(F) and the sample displacement ΔX_(D). The module 1050facilitates the isolation of the mechanical testing instrument 114 fromthe thermomechanical drift of the system frame 1000 by using thedetermined difference between the probe displacement ΔX_(F) and thesample displacement ΔX_(D). For instance, the thermomechanical drift ofthe system frame 1000 affects the determination of the displacement ofan indentation depth of the probe 114 relative to the sample 300. Forexample, the system 1000 will read a variable indentation depth or forceover a period of time due to the thermomechanical drift of the systemframe 1010 and corresponding fluctuations caused by expansion orcontraction of the frame 1010. In the example shown in FIG. 10, becausethe first interferometer 1040A is coupled between the probe 310 and theremainder of the instrument 1040 the interferometer 1040A measuresdisplacement of the probe 310 relative to the instrument 1040. Further,because the second interferometer 1040B is coupled between theinstrument 114 and the sample 300 (or the sample stage) the secondinterferometer 1040B measures the displacement of the sample 300relative to the mechanical testing instrument 1040. The differencebetween the probe displacement ΔX_(F) and the sample displacement ΔX_(D)corresponds to the actual displacement of the probe (e.g., indentationdepth or the like) relative to the sample without inclusion of thethermomechanical drift of the system frame 1010. Stated another way, bycoupling the interferometer system with the mechanical testinginstrument 1040 and measuring the position of the probe 310 and thesample 300 the system frame 1010 and any thermomechanical drift of theframe 1010 are effectively isolated and removed from consideration.Accordingly, the thermomechanical drift of the system frame 1010 isisolated by and removed by the system 1000 to enhance the precision andaccuracy of the determined indentation depth of the probe 140 relativeto the sample 300.

In another example, the systems and methods described herein minimize(e.g., minimize or eliminate) thermomechanical drift in one or more ofthe mechanical testing instrument, sample stage or the like. Asdescribed herein, the probe 310 is optionally engaged with the sample300 to determine one or more characteristics of the sample 300 accordingto a displacement of the probe 310 (indentation depth, tensileretraction or the like) and a load applied to the sample 300. Themechanical testing instrument 114, the sample 300, or the sample stage(e.g., the multiple degree of freedom sample stage 116) are subject tothermomechanical drift. The system 1000 optionally facilitatescorrection of thermomechanical drift in these components. In an example,the thermomechanical drift is corrected actively or passively. Forinstance, thermomechanical drift is actively corrected during the testat the interface of the probe 310 to the sample 300 (e.g., at engagementand testing). In another example, the thermomechanical drift experiencedduring measurements is passively isolated and removed after the test.

In an example, the thermomechanical drift is actively corrected bytranslational driving (e.g., repositioning or actuating) of one or moreof the probe 310 or the sample 300 in a compensation (e.g., inverse)scheme relative to the thermomechanical drift that corresponds to adetermined displacement. In an example, the probe 310 is translated(e.g., actuated) to counteract (e.g., cancel, minimize, counterbalance,or the like) the thermomechanical drift. For example, the sample 300translates due to thermomechanical drift in the sample stage or thesystem frame 1000. The probe 310 is translationally driven to correct(e.g., chase, follow, cancel out, or the like) the drift of the sample300. Accordingly, the system 1000 improves the accuracy of determiningthe one or more characteristics of the sample 300. In another example,the thermomechanical drift causes the load sensed by the sensor tofluctuate (e.g., the force between the probe 310 and the sample variesbecause the position of the sample 300 relative to the probe 310 changeswith the thermomechanical drift). In this example, the thermomechanicaldrift is corrected by varying the load to compensate for thethermomechanical drift and accordingly the load is consistently appliedto the probe 310 or the sample 300.

In yet another example, the thermomechanical drift is passivelycorrected by subtraction of detected thermomechanical drift from themeasured displacement of the probe 310 or the determined one or morecharacteristics of the sample 300. For instance, the probe 310 isengaged with the sample 300 and displaced relative to the sample byapplying a load to the probe 310. The displacement of the probe 310 ismeasured (e.g., with a sensor, for example a transducer). The determinedthermomechanical drift is subtracted from displacement of the probe 310,and the accuracy of the measured displacement of the probe 310 isthereby improved. In another example, the fluctuation corresponding tothermomechanical drift is utilized to correct the measured load bysubtracting the load fluctuations attributed to the thermomechanicaldrift.

FIG. 11 is a schematic view of the interferometer system 1030. Theinterferometer system 1030 includes a laser source 1111 that generates acoherent light beam (e.g., a light beam that includes a specifiedwavelength). Additionally, the system 1030 includes an optical fiber1120 coupled with the laser source 1111. The optical fiber 1120 isoptionally coupled with one or more components of the system 1030 tofacilitate the transmission of one or more beams of light between thecomponents. In an example, the optical fiber 1120 optically couples thelaser source 1111, a circulator 1112, a fiber stretcher 1113, anelectromechanical oscillator 1114, and an optical detector 1117.

The circulator 1112 facilitates the transmission of optical signalswithin the system 1030. For instance, the circulator 1112 optionallydirects the first coherent beam of light from the laser generator 1030toward the target 1030. Additionally, the circulator 1112 optionallydirects the first component beam and the second component beam(described herein) toward the optical detector 1117.

The fiber stretcher 1113 dynamically stretches the optical fiber 1120 tochange a path length of one or more beams of light as the beams aretransmitted through the optical fiber (e.g., the first coherent beam orthe first and second component beams). The optical fiber 1120 includes atemperature sensitivity characteristic that causes a low frequencythermomechanical drift in measurements conducted with the system 1030.The fiber stretcher 1113 shifts the low frequency measurement to ahigher frequency domain, where the higher frequency value is readilyfiltered to correct for thermomechanical drift within the system 1030.

In an example, the optical fiber 1120 is optionally wrapped around apiezoelectric element that expands and contracts with an application ofcurrent to the piezoelectric element. In this example, because theoptical fiber 1120 is wrapped around the piezoelectric element, and thepiezoelectric element expands and contracts, the path length of theoptical fiber 1120 is correspondingly lengthened and shortened by theexpansion and contraction of the piezoelectric element. A resonator 1115is in communication with the fiber stretcher 1113 and supplies anelectrical signal to the fiber stretcher 1113 to dynamically stretch theoptical fiber 1120 (e.g., at several kilohertz).

As described herein, the system 1030 optionally includes theelectromechanical oscillator 1114. The electromechanical oscillator 1114modulates a cavity length (e.g., the distance between a fiber end 1125and the target 130) that in turn modulates the interference signal(e.g., the interference signal is not purely sinusoidal). In an example,the optical fiber 1120 includes the fiber end 1125. The fiber end 1125is optionally coupled with the electromechanical oscillator 1114 and theelectromechanical oscillator 1114 modulates (e.g., oscillates, vibrates,or the like) the fiber end 1125 at a specified frequency and a specifiedamplitude. In an example, the modulation amplitude of the fiber end 1125so that an amplitude of a demodulated interference signal at anoperating frequency is equal to the amplitude of demodulatedinterference signal at double the operating frequency (e.g., the firstharmonic). In another example, the fiber end 1125 modulates at adifferent multiple frequency of the operating frequency of the fiberstretcher 1113.

Referring again to FIG. 11, the fiber end 1125 is directed at the target1130 to deliver the component beam (e.g., the second component beam, oractive beam) toward the target 1130. The modulation of the fiber end1125 by the electromechanical oscillator 1114 modulates the distancebetween the fiber end 1125 and the target 1130. Accordingly, the signalreceived by the optical detector 1117 (e.g., the combined first andsecond component beams) is modulated. Modulating the fiber end 1125facilitates the removal of signal noise and improves the determinationof the displacement between the fiber end 1125 and the target 1130(e.g., between the second interferometer 1040B and the sample 300 shownin FIG. 3).

In an example, the synchronous demodulator 1118 samples the opticaldetector 1117 at the same frequency that the electromechanicaloscillator 1114 modulates the fiber end 1125. In this example, becausethe fiber end 1125 is modulated, and the signal received by the opticaldetector 1117 is correspondingly modulated, synchronously demodulatingthe signal extends a displacement detection range between the fiber end1125 and the target 1130 beyond single fringe interferometry.Accordingly, the determination of the distance (or displacement) of thetarget relative to the fiber end 1125 is thereby improved (e.g., thesignal-to-noise ratio of the combined component beams is improved).

FIG. 12 shows one example of a method 1200 for correctingthermomechanical drift with a mechanical testing assembly having asample stage and a mechanical testing instrument. In describing themethod 1200, reference is made to one or more components, features,functions and operations previously described herein. Where convenient,reference is made to the components, features, operations and the likewith reference numerals. The reference numerals provided are exemplaryand are not exclusive. For instance, components, features, functions,operations and the like described in the method 1200 include, but arenot limited to, the corresponding numbered elements provided herein andother corresponding elements described herein (both numbered andunnumbered) as well as their equivalents.

At 1210, a probe 310 of the mechanical testing instrument 114 is engagedwith a sample 300 coupled with the sample stage (e.g., the multipledegree of freedom sample stage 116), wherein one or more of themechanical testing instrument, the sample or the sample stage aresubject to thermomechanical drift. At 1220, the engaged probe 310 isdisplaced relative to the sample 300 with a load. At 1230, one or moreof the displacement or the load is measured. At 1240, one or morecharacteristics of the sample are determined with the probe according tothe displacement and the load.

At 1250, the thermomechanical drift is corrected in one or more of themeasured displacement of the probe with the sample (e.g., indentationdepth, retraction length or the like) or the determined one or morecharacteristics. At 1260, correcting for the thermomechanical driftincludes independently measuring a displacement of the probe relative tothe system frame and independently measuring a displacement of thesample relative to the system frame with non-contact sensors. Severaloptions for the method 1200 follow. In one example, correcting for thethermomechanical drift includes splitting a coherent beam of light froma laser source into at least first and second component beams.Additionally, correcting for the thermomechanical drift optionallyincludes directing the first component beam from a fiber end 1025 of afiber 1020 against one of the mechanical testing instrument 114, sample300 or the sample stage. Further, correcting for the thermomechanicaldrift optionally includes combining the first and second componentbeams. Still further, correcting for the thermomechanical driftoptionally includes determining a differential displacement between theprobe and the sample, and the phase difference corresponds to thethermomechanical drift of a component, such as the system frame 1010where the fiber end 1025 is coupled with the mechanical testinginstrument 114 (or 1040) and detects movement of the sample 300(corresponding to the system frame 1010).

In one example, the method 1200 includes determining a displacement ofthe probe 310. For instance, a first interferometer is directed towardsone of the probe 310 or an instrument housing of (e.g., the remainderof) the mechanical testing instrument 114 (or 1040). The secondinterferometer measures the displacement of the probe 310 relative tothe remainder of the mechanical testing instrument 114 (or 1040). Thedifference (corresponding to thermomechanical drift of the system frame1010 in an example) is used to determine the displacement of the probe310 relative to the sample 300 and thereby isolate and removethermomechanical drift.

Various Notes & Examples

Aspect 1 can include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, can cause the device to perform acts, or an article ofmanufacture), such as can include or use a probe heating jacketconfigured for heating a mechanical testing instrument having a probe,the probe heating jacket comprising: at least one fastening interfaceconfigured for coupling with the mechanical testing instrument; and aheating element extending from the at least one fastening interface, theheating element includes: a jacket wall coupled with the at least onefastening interface; and the jacket wall extends around a probe recess,the jacket wall is configured to receive the probe of the mechanicaltesting instrument within the probe recess, and the heating element ismechanically isolated from the probe with a probe gap.

Aspect 2 can include or use, or can optionally be combined with thesubject matter of Aspect 1, to optionally include or use wherein thejacket wall includes an interior surface facing the probe recess, andthe interior surface is configured to direct heat across the probe gapto the probe.

Aspect 3 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 1 or 2 to optionallyinclude or use wherein the jacket wall is a radiative heating element.

Aspect 4 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 1 through 3 tooptionally include or use wherein the jacket wall is an inductiveheating element.

Aspect 5 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 1 through 3 tooptionally include or use the mechanical testing instrument and theprobe.

Aspect 6 can include or use, or can optionally be combined with thesubject matter of Aspect 5 to optionally include or use wherein theprobe is received in the probe recess of the jacket wall, the probe ismechanically isolated from the heating element, and the probe is spacedfrom the interior surface of the jacket wall by the probe gap.

Aspect 7 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 5 or 6 to optionallyinclude or use wherein the mechanical testing instrument is configuredto move the probe within the probe recess, the probe movementmechanically isolated from the jacket wall.

Aspect 8 can include or use, or can optionally be combined with thesubject matter of Aspect 7 to optionally include or use wherein theprobe has one or more degrees of freedom relative to the heating jacket.

Aspect 9 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 5 through 8 tooptionally include or use wherein: the jacket wall includes a jacketprofile; the probe includes a probe profile, and the probe profilecorresponds with the jacket profile with the probe gap therebetween theheating element and the probe; and the jacket wall is in proximity tothe probe, and surrounds the probe according to the corresponding jacketand probe profiles.

Aspect 10 can include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, can cause the device to perform acts, or an article ofmanufacture), such as can include or use a mechanical testing system,comprising: a mechanical testing instrument having a movable probeconfigured to test one or more mechanical properties of a sample of amaterial; a probe heating jacket configured for heating the mechanicaltesting system, the probe heating jacket including: at least onefastening interface configured for coupling with the mechanical testinginstrument; a heating element extending from the at least one fasteninginterface, the heating element includes: a jacket wall coupled with theat least one fastening interface, the jacket wall extends around a proberecess, the jacket wall is configured to receive a probe of themechanical testing instrument within the probe recess, and the heatingelement is mechanically isolated from the probe with a probe gap.

Aspect 11 can include or use, or can optionally be combined with thesubject matter of Aspect 10, to optionally include or use wherein themechanical testing system is configured to move the probe within theprobe recess, the probe movement mechanically isolated from the jacketwall.

Aspect 12 can include or use, or can optionally be combined with thesubject matter of Aspect 11 to optionally include or use wherein probemovement includes one or more of translation, rotation or lateralscratching movement within the probe recess, and the jacket wallmechanically isolates the probe with each of the one or more movements.

Aspect 13 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 10 through 12 tooptionally include or use wherein: the jacket wall includes a jacketprofile; the probe includes a probe profile, and the probe profilecorresponds with the jacket profile with the probe gap therebetween theheating element and the probe; and the jacket wall is in proximity tothe probe, and surrounds the probe according to the corresponding jacketand probe profiles.

Aspect 14 can include or use, or can optionally be combined with thesubject matter of Aspect 13 to optionally include or use wherein theheating element is a radiative heating element, a convective heatingelement, or an inductive heating element.

Aspect 15 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 10 through 14 tooptionally include or use an environmental conditioning chamber, whereinthe chamber is configured to provide a conditioned environment, and theconditioned environment has one or more environmental characteristicsthat are different than a surrounding environment of the chamber.

Aspect 16 can include or use, or can optionally be combined with thesubject matter of Aspect 15 to optionally include or use wherein the oneor more environmental characteristics includes: temperature, pressure,humidity or fluid composition.

Aspect 17 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 15 or 16 tooptionally include or use wherein the probe heating jacket is positionedin the environmental conditioning chamber.

Aspect 18 can include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, can cause the device to perform acts, or an article ofmanufacture), such as can include or use a method for testing themechanical properties of a material, comprising: positioning a probe ofa mechanical testing instrument within a probe recess of a probe heatingjacket having a jacket wall, wherein the jacket wall includes a jacketprofile corresponding with a probe profile of the probe, and the jacketwall is proximate to the probe according to the correspondence of thejacket profile to the probe profile; energizing a heating element of theprobe heating jacket; directing heat from the jacket wall to the probethrough a probe gap according to the correspondence of the jacketprofile to the probe profile to alter the temperature of the probe;moving the probe to perform a mechanical or electromechanical test; andwherein during movement of the probe, the probe is mechanically isolatedfrom the jacket wall.

Aspect 19 can include or use, or can optionally be combined with thesubject matter of Aspect 18, to optionally include or use wherein movingthe probe includes one or more of translation, rotation or lateralscratching movement within the probe recess, and the jacket wallmechanically isolates the probe with each of the one or more movements.

Aspect 20 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 18 or 19 tooptionally include or use engaging the probe with a sample of amaterial.

Aspect 21 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 18 through 20 tooptionally include or use wherein engaging the probe with the sampleincludes applying a force to the probe with a mechanical testinginstrument.

Aspect 22 can include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, can cause the device to perform acts, or an article ofmanufacture), such as can include or use a method for correcting forthermomechanical drift with a mechanical testing assembly having asample stage and a mechanical testing instrument coupled to a systemframe, the method comprising: engaging a probe of the mechanical testinginstrument with a sample coupled with the sample stage, one or more ofthe mechanical testing instrument, the sample or the sample stage aresubject to thermomechanical drift; displacing the engaged probe relativeto the sample with a load; measuring one or more of the displacement orthe load; determining one or more characteristics of the sample with theprobe according to the displacement and the load; and correcting for thethermomechanical drift in one or more of the measured displacing of theprobe with the sample or the determined one or more characteristics,correcting includes: independently measuring a displacement of the proberelative to the system frame and independently measuring a displacementof the sample relative to the system frame with non-contact sensors.

Aspect 23 can include or use, or can optionally be combined with thesubject matter of Aspect 22, to optionally include or use whereinmeasuring the displacement of the probe or the displacement of thesample includes one or more of quadrature detection or fringe counting.

Aspect 24 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 22 or 23 tooptionally include or use wherein the non-contact sensors include one ormore of a laser interferometer, a fiber light displacement sensor, aconfocal sensor, or a capacitance sensor.

Aspect 25 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 22 through 24 tooptionally include or use wherein the non-contact sensor is a laserinterferometer, and the independently measuring includes: generating acoherent beam of light into one or more optical fibers; transmitting thecoherent beam of light through the one or more optical fibers to a fiberend; splitting the coherent beam of light into a first component beamand a second component beam; reflecting the first component beam off afiber interface with a medium; reflecting the second component beam offthe sample, the sample stage, or the mechanical testing instrument; andcombining the first component beam and the second component beam at anoptical detector; and determining a displacement of the sample, thesample stage, or the mechanical testing instrument relative to thesystem frame by synchronously demodulating the combined first componentbeam and the second component beam.

Aspect 26 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 22 through 25 tooptionally include or use wherein correcting for the thermomechanicaldrift includes at least one of active or passive correction for theengagement of the probe with the sample or measurement of the one ormore characteristics, respectively.

Aspect 27 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 22 through 26 tooptionally include or use wherein correcting for the thermomechanicaldrift includes active correction for thermomechanical drift includingtranslational driving of one or more of the probe or the sample in orderto cancel out the thermomechanical drift.

Aspect 28 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 22 through 27 tooptionally include or use wherein correcting for the thermomechanicaldrift includes passive correction for thermomechanical drift includingsubtraction of the thermomechanical drift during the determining of theone or more characteristics of the sample.

Aspect 29 can include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, can cause the device to perform acts, or an article ofmanufacture), such as can include or use a system to correct forthermomechanical drift in a mechanical testing assembly, comprising: asystem frame, wherein the system frame is subject to thermomechanicaldrift; a sample stage coupled with the system frame; a mechanicaltesting instrument coupled with the system frame, the mechanical testinginstrument includes a movable probe configured to engage with a sampleand displace a depth relative to the sample with a load; a laserinterferometer system coupled with the mechanical testing instrument,the laser interferometer system includes: a first interferometer coupledbetween the probe and a remainder of the mechanical testing instrument,the first interferometer is configured to determine a probe displacementof the probe relative to the remainder of the mechanical testinginstrument; a second interferometer coupled between the mechanicaltesting instrument and the system frame, the second interferometer isconfigured to determine a sample displacement of the sample stage or thesample relative to the mechanical testing instrument; and an isolationand measurement module configured to: determine a difference between theprobe displacement and the sample displacement; isolate the mechanicaltesting instrument from the thermomechanical drift of the system frameusing the determined difference between the probe displacement and thesample displacement.

Aspect 30 can include or use, or can optionally be combined with thesubject matter of Aspect 29, to optionally include or use anelectromechanical oscillator configured to oscillate a first fiber endor the second fiber end to provide a modulated optical signal.

Aspect 31 can include or use, or can optionally be combined with thesubject matter of one or any combination of Aspects 29 or 30 tooptionally include or use a fiber stretcher configured to dynamicallystretch a fiber of the first interferometer or the second interferometerto mitigate thermally induced drift within the fiber.

Aspect 32 can include or use, or can optionally be combined with thesubject matter of Aspect 31 to optionally include or use wherein thefiber stretcher includes an electromechanical element.

Aspect 33 can include or use, or can optionally be combined with anyportion or combination of any portions of any one or more of Aspects 1through 33 to include or use, subject matter that can include means forperforming any one or more of the functions of Examples 1 through 20, ora machine-readable medium including instructions that, when performed bya machine, cause the machine to perform any one or more of the functionsof Examples 1 through 20.

Each of these non-limiting examples can stand on its own, or can becombined in various permutations or combinations with one or more of theother examples.

The above description includes references to the accompanying drawings,which form a part of the detailed description. The drawings show, by wayof illustration, specific embodiments in which the invention can bepracticed. These embodiments are also referred to herein as “examples.”Such examples can include elements in addition to those shown ordescribed. However, the present inventors also contemplate examples inwhich only those elements shown or described are provided. Moreover, thepresent inventors also contemplate examples using any combination orpermutation of those elements shown or described (or one or more aspectsthereof), either with respect to a particular example (or one or moreaspects thereof), or with respect to other examples (or one or moreaspects thereof) shown or described herein.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Geometric terms, such as “parallel”, “perpendicular”, “round”, or“square”, are not intended to require absolute mathematical precision,unless the context indicates otherwise. Instead, such geometric termsallow for variations due to manufacturing or equivalent functions. Forexample, if an element is described as “round” or “generally round,” acomponent that is not precisely circular (e.g., one that is slightlyoblong or is a many-sided polygon) is still encompassed by thisdescription.

Method examples described herein can be machine or computer-implementedat least in part, Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods as described in theabove examples, An implementation of such methods can include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code can include computer readable instructions forperforming various methods. The code may form portions of computerprogram products. Further, in an example, the code can be tangiblystored on one or more volatile, non-transitory, or non-volatile tangiblecomputer-readable media, such as during execution or at other times.Examples of these tangible computer-readable media can include, but arenot limited to, hard disks, removable magnetic disks, removable opticaldisks (e.g., compact disks and digital video disks), magnetic cassettes,memory cards or sticks, random access memories (RAMs), read onlymemories (ROMs), and the like.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

The claimed invention is:
 1. A probe heating jacket configured forheating a mechanical testing instrument having a probe, the probeheating jacket comprising: at least one fastening interface configuredfor coupling with the mechanical testing instrument; and a heatingelement extending from the at least one fastening interface, the heatingelement includes: a jacket wall coupled with the at least one fasteninginterface; and the jacket wall extends around a probe recess, the jacketwall is configured to receive the probe of the mechanical testinginstrument within the probe recess, and the heating element ismechanically isolated from the probe with a probe gap.
 2. The probeheating jacket of claim 1, wherein the jacket wall includes an interiorsurface facing the probe recess, and the interior surface is configuredto direct heat across the probe gap to the probe.
 3. The probe heatingjacket of claim 1, wherein the jacket wall is a radiative heatingelement.
 4. The probe heating jacket of claim 1, wherein the jacket wallis an inductive heating element.
 5. The probe heating jacket of claim 1,further comprising the mechanical testing instrument and the probe. 6.The probe heating jacket of claim 5, wherein the probe is received inthe probe recess of the jacket wall, the probe is mechanically isolatedfrom the heating element, and the probe is spaced from the interiorsurface of the jacket wall by the probe gap.
 7. The probe heating jacketof claim 5, wherein the mechanical testing instrument is configured tomove the probe within the probe recess, the probe movement mechanicallyisolated from the jacket wall.
 8. The probe heating jacket of claim 7,wherein the probe has one or more degrees of freedom relative to theheating jacket.
 9. The probe heating jacket of claim 5, wherein: thejacket wall includes a jacket profile; the probe includes a probeprofile, and the probe profile corresponds with the jacket profile withthe probe gap therebetween the heating element and the probe; and thejacket wall is in proximity to the probe, and surrounds the probeaccording to the corresponding jacket and probe profiles.
 10. Amechanical testing system, comprising: a mechanical testing instrumenthaving a movable probe configured to test one or more mechanicalproperties of a sample of a material; a probe heating jacket configuredfor heating the mechanical testing system, the probe heating jacketincluding: at least one fastening interface configured for coupling withthe mechanical testing instrument; a heating element extending from theat least one fastening interface, the heating element includes: a jacketwall coupled with the at least one fastening interface; and the jacketwall extends around a probe recess, the jacket wall is configured toreceive a probe of the mechanical testing instrument within the proberecess, and the heating element is mechanically isolated from the probewith a probe gap.
 11. The mechanical testing system of claim 10, whereinthe mechanical testing system is configured to move the probe within theprobe recess, the probe movement mechanically isolated from the jacketwall.
 12. The mechanical testing system of claim 11, wherein probemovement includes one or more of translation, rotation or lateralscratching movement within the probe recess, and the jacket wallmechanically isolates the probe with each of the one or more movements.13. The mechanical testing system of claim 10, wherein: the jacket wallincludes a jacket profile; the probe includes a probe profile, and theprobe profile corresponds with the jacket profile with the probe gaptherebetween the heating element and the probe; and the jacket wall isin proximity to the probe, and surrounds the probe according to thecorresponding jacket and probe profiles.
 14. The mechanical testingsystem of claim 13, wherein the heating element is a radiative heatingelement, a convective heating element, or an inductive heating element.15. The mechanical testing system of claim 10, further comprising anenvironmental conditioning chamber, wherein the chamber is configured toprovide a conditioned environment, and the conditioned environment hasone or more environmental characteristics that are different than asurrounding environment of the chamber.
 16. The mechanical testingsystem of claim 15, wherein the one or more environmentalcharacteristics includes: temperature, pressure, humidity or fluidcomposition.
 17. The mechanical testing system of claim 15, wherein theprobe heating jacket is positioned in the environmental conditioningchamber.
 18. A method for testing the mechanical properties of amaterial, comprising: positioning a probe of a mechanical testinginstrument within a probe recess of a probe heating jacket having ajacket wall, wherein the jacket wall includes a jacket profilecorresponding with a probe profile of the probe, and the jacket wall isproximate to the probe according to the correspondence of the jacketprofile to the probe profile; energizing a heating element of the probeheating jacket; directing heat from the jacket wall to the probe througha probe gap according to the correspondence of the jacket profile to theprobe profile to alter the temperature of the probe; moving the probe toperform a mechanical or electromechanical test; and wherein duringmovement of the probe, the probe is mechanically isolated from thejacket wall.
 19. The method of claim 18, wherein moving the probeincludes one or more of translation, rotation or lateral scratchingmovement within the probe recess, and the jacket wall mechanicallyisolates the probe with each of the one or more movements.
 20. Themethod of claim 18, further comprising engaging the probe with a sampleof a material.
 21. The method of claim 18, wherein engaging the probewith the sample includes applying a force to the probe with a mechanicaltesting instrument.
 22. A method for correcting for thermomechanicaldrift with a mechanical testing assembly having a sample stage and amechanical testing instrument coupled to a system frame, the methodcomprising: engaging a probe of the mechanical testing instrument with asample coupled with the sample stage, one or more of the mechanicaltesting instrument, the sample or the sample stage are subject tothermomechanical drift; displacing the engaged probe relative to thesample with a load; measuring one or more of the displacement or theload; determining one or more characteristics of the sample with theprobe according to the displacement and the load; and correcting for thethermomechanical drift in one or more of the measured displacing of theprobe with the sample or the determined one or more characteristics,correcting includes: independently measuring a displacement of the proberelative to the system frame and independently measuring a displacementof the sample relative to the system frame with non-contact sensors. 23.The method of claim 22, wherein measuring the displacement of the probeor the displacement of the sample includes one or more of quadraturedetection or fringe counting.
 24. The method of claim 22, wherein thenon-contact sensors include one or more of a laser interferometer, afiber light displacement sensor, a confocal sensor, or a capacitancesensor.
 25. The method of claim
 22. wherein the non-contact sensor is alaser interferometer, and the independently measuring includes:generating a coherent beam of light into one or more optical fibers;transmitting the coherent beam of light through the one or more opticalfibers to a fiber end; splitting the coherent beam of light into a firstcomponent beam and a second component beam; reflecting the firstcomponent beam off a fiber interface with a medium; reflecting thesecond component beam off the sample, the sample stage, or themechanical testing instrument; and combining the first component beamand the second component beam at an optical detector; and determining adisplacement of the sample, the sample stage, or the mechanical testinginstrument relative to the system frame by synchronously demodulatingthe combined first component beam and the second component beam.
 26. Themethod of claim 22, wherein correcting for the thermomechanical driftincludes at least one of active or passive correction for the engagementof the probe with the sample or measurement of the one or morecharacteristics, respectively.
 27. The method of claim
 22. whereincorrecting for the thermomechanical drift includes active correction forthermomechanical drift including translational driving of one or more ofthe probe or the sample in order to cancel out the thermomechanicaldrift.
 28. The method of claim 22, wherein correcting for thethermomechanical drift includes passive correction for thermomechanicaldrift including subtraction of the thermomechanical drift during thedetermining of the one or more characteristics of the sample.
 29. Asystem to correct for thermomechanical drift in a mechanical testingassembly, comprising: a system frame, wherein the system frame issubject to thermomechanical drift; a sample stage coupled with thesystem frame; a mechanical testing instrument coupled with the systemframe, the mechanical testing instrument includes a movable probeconfigured to engage with a sample and displace a depth relative to thesample with a load; a laser interferometer system coupled with themechanical testing instrument, the laser interferometer system includes:a first interferometer coupled between the probe and a remainder of themechanical testing instrument, the first interferometer is configured todetermine a probe displacement of the probe relative to the remainder ofthe mechanical testing instrument; a second interferometer coupledbetween the mechanical testing instrument and the system frame, thesecond interferometer is configured to determine a sample displacementof the sample stage or the sample relative to the mechanical testinginstrument; and an isolation and measurement module configured to:determine a difference between the probe displacement and the sampledisplacement; isolate the mechanical testing instrument from thethermomechanical drift of the system frame using the determineddifference between the probe displacement and the sample displacement.30. The system of claim 29, further comprising an electromechanicaloscillator configured to oscillate a first fiber end or the second fiberend to provide a modulated optical signal.
 31. The system of claim 29,further comprising a fiber stretcher configured to dynamically stretch afiber of the first interferometer or the second interferometer tomitigate thermally induced drift within the fiber.
 32. The system ofclaim 31, wherein the fiber stretcher includes an electromechanicalelement.